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What are the production links of PCBA processing?
2026/2/24
PCBA is PCB circuit board art, such as PCB circuit board manufacturing, component procurement and inspection, SMT patch processing, plug-in processing, program burning, testing, aging, etc. The PCBA processing process involves many links. In order to produce good products, we must control the quality of each link.
After receiving the PCBA order, analyze the Gerber file, pay attention to the relationship between the PCB hole spacing and the board's load-bearing capacity, do not bend or break, and whether high-frequency signal interference, impedance and other key factors are considered in the wiring.
2. Component procurement and inspection.
Parts procurement requires strict control of channels, and goods must be picked up from large traders and original manufacturers to avoid 100% second-hand materials and fake materials. In addition, special incoming material inspection positions have been set up to strictly inspect the following items to ensure that parts are fault-free.
PCB: Reflow oven temperature test. Flying lines are prohibited. Whether the via holes are blocked or leaking ink; whether the board surface is bent;
IC: Check whether the silk screen printing is completely consistent with the BOM, and store it at constant temperature and humidity;
Other common materials: Check silk screen, appearance, power measurement, etc. The inspection items are carried out by sampling, and the proportion is generally 1-3%.
3.SMT chip processing.
Solder paste printing and reflow oven temperature control are key points. It is very important that the laser stencil is of good quality and meets process requirements. According to the requirements of the PCB, some stencils need to be added or reduced, or U holes need to be used, and the stencils are made according to the process requirements. Gentle speed control of the reflow oven is crucial for solder paste penetration and soldering reliability and can be controlled according to normal SOP operating guidelines. In addition, AI testing needs to be rigorously implemented to reduce the adverse effects of human factors.
After receiving the PCBA order, analyze the Gerber file, pay attention to the relationship between the PCB hole spacing and the board's load-bearing capacity, do not bend or break, and whether high-frequency signal interference, impedance and other key factors are considered in the wiring.
2. Component procurement and inspection.
Parts procurement requires strict control of channels, and goods must be picked up from large traders and original manufacturers to avoid 100% second-hand materials and fake materials. In addition, special incoming material inspection positions have been set up to strictly inspect the following items to ensure that parts are fault-free.
PCB: Reflow oven temperature test. Flying lines are prohibited. Whether the via holes are blocked or leaking ink; whether the board surface is bent;
IC: Check whether the silk screen printing is completely consistent with the BOM, and store it at constant temperature and humidity;
Other common materials: Check silk screen, appearance, power measurement, etc. The inspection items are carried out by sampling, and the proportion is generally 1-3%.
3.SMT chip processing.
Solder paste printing and reflow oven temperature control are key points. It is very important that the laser stencil is of good quality and meets process requirements. According to the requirements of the PCB, some stencils need to be added or reduced, or U holes need to be used, and the stencils are made according to the process requirements. Gentle speed control of the reflow oven is crucial for solder paste penetration and soldering reliability and can be controlled according to normal SOP operating guidelines. In addition, AI testing needs to be rigorously implemented to reduce the adverse effects of human factors.
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